A/D ----- Analog to Digital
AC ----- Alternating Current
ACK ----- Acknowledge
ADDR ----- Address
APROX ----- Approximately
ASCII ----- American Standard Computer Information Interchange
ATE ----- Automatic Test Equipment
ATP ----- Acceptance Test Procedure
ATT ----- Attitude
ATTN ----- Attention
AUD ----- Audio
AUTO ----- Automatic
AUX ----- Auxilliary
AV ----- Audio Visual
AVE ----- Average

BAT ----- Battery
BATT ----- Battery
BB ----- Book to Bill
BB ----- Broadband
BGA ----- Ball Grid Array
BLK ----- Black
BRK ----- Brake
BRT ----- Bright
BW ----- Bandwidth

CAB ----- Cabin
CAD ----- Computer Aided Design
CAM ----- Computer Aided Manufacturing
CAPE ----- Computer Aided Project Engineering
CCD ----- Charge Coupled Devices
CEO ----- Chief Executive Officer
CFO ----- Chief Financial Officer
CFP ----- Ceramic Flat Package
CHAN ----- Channel
CHG ----- Change
CIS ----- Contact Image Sensor
CLR ----- Clear
CMNT ----- Comment
CMOS ----- Complementary Metal Oxide Semiconductor
CNTR ----- Control
COB ----- Chip On Board
COF ----- Chip On Film
COG ----- Chip On Glass
COMM ----- Commercial
COMM ----- Communication
CON ----- Contrast
CONFIG ----- Configuration
CONT ----- Control
COO ----- Chief Operating Officer
COO ----- Cost Of Ownership
CPA ----- Certified Public Accountant
CPU ----- Central Processing Unit
CRES ----- Contact Resistance
CSP ----- Chip Size Package
CTR ----- Centered
CTRL ----- Control

D/A ----- Digital to Analog
DB ----- Decibel
DC ----- Direct Current
DEC ----- Decode
DEC ----- Decrease
DEG ----- Degrees
DEL ----- Delete
DELT ----- Delta
DFN ----- Dual Flatpack No-leaded
DIP ----- Dual Inline Package
DIR ----- Direction
DISP ----- Display
DIST ----- Distance
DN ----- Down
DR ----- Door
DRAM ----- Dynamic Random Access Memory
DSBL ----- Disable
DSSA ----- Domain Specific Software Architecture
DTC ----- Design To Cost
DTE ----- Data Terminal Equipment
DTL ----- Data-Time Logged
DTR ----- Data Terminal Ready
DWN ----- Down
DWNLD ----- Download

ECN ----- Engineering Change Notice
ECO ----- Engineering Change Order
ECP ----- Engineering Change Proposal
ECR ----- Engineering Change Request
ECS ----- Engineering Change Support
EEPROM ----- Electrically Erasable Programmable Read Only Memory
ELEC ----- Electrical
EM ----- Electromagnetic
EMC ----- Electromagnetic Compatibility
EME ----- Electromagnetic Environment
EMER ----- Emergency
EMERG ----- Emergency
EMI ----- Electromagnetic Interference
EMP ----- Electromagnetic Pulse
ENBL ----- Enable
ENC ----- Encode
ENDR ----- Endurance
ENG ----- Engine
ENGA ----- Engage
ENV ----- Envelope
ENVIR ----- Environment
EOF ----- End Of File
EPROM ----- Erasable Programmable Read Only Memory
EQP ----- Equipment
ERR ----- Engineering Revision Request
ERSE ----- Erase
ESC ----- Escape
ESD ----- Electrostatic Discharge
ESS ----- Environmental Stress Screening
ESS ----- Essential
ETA ----- Estimated Time of Arrival
ETE ----- Estimated Time Enroute
EXT ----- Extend

FAB ----- Fabrication
FAIL ----- Failure
FLTR ----- Filter
FM ----- From
FMEA ----- Failure Mode and Effects Analysis
FMECA ----- Failure Mode Effects and Criticality Analysis
FOB ----- Freight On Board
FOC ----- Focus
FOV ----- Field Of View
FREQ ----- Frequency
FTP ----- File Transfer Protocol
FU ----- Fuse
FWD ----- Forward

GND ----- Ground
GRD ----- Guard
GRND ----- Ground
GUI ----- Graphic User Interface
GUID ----- Guidance
GW ----- Gross Weight

H/W ----- Hardware
HC ----- Hazardous Code
HF ----- High Frequency
HI ----- High
HLD ----- Hold
HOR ----- Horizontal
HORIZ ----- Horizontal
HP ----- Horse Power
HQFP ----- Quad Flat Package with Heatspreader
HZ ----- Hertz

I/O ----- Input/Ouput
IC ----- Integrated Circuit
ID ----- Identification
ID ----- Interface Device
ID ----- Interface Diagnostics
ID ----- Interface Diagram
IDR ----- Installation Design Review
IEEE ----- Institute of Electrical and Electronic Engineers
IF ----- Intermediate Frequency
IGES ----- Initial Graphics Exchange Specification
INC ----- Increase
INCOMPLT ----- Incomplete
INCOR ----- Incorrect
IND ----- Indicator
INIT ----- Initiatetmtinitialize
INST ----- Instrument
INTER ----- Intermediate
IPR ----- In-Process Review
IPS ----- Inches Per Secon
IR ----- Infrared
ISE ----- In-Service Engineer
ISLN ----- Isolation
IU ----- Interface Unit

JQR ----- Job Qualification Requirement

KGD ----- Known Good Die
KVA ----- Kilovolt-Amps
KW ----- Kilowatt(s)

L ----- Left
LAN ----- Local Area Network
LCC ----- Leaded Chip Carrier
LCC ----- Life Cycle Costing
LCK ----- Lock
LED ----- Light Emitting Diode
LEN ----- Length
LF ----- Low Frequency
LGA ----- Land Grid Array
LIN ----- Linear
LLCC ----- Lead Less Chip Carrier
LLP ----- Leadless Leadframe Package
LO ----- Low
LOC ----- Lead On Chip
LQFP ----- Low Profile Quad Flat Package
LSI ----- Large Scale Integration
LT ----- Light
LTCC ----- Low Temperature Cofired Ceramic
LTS ----- Lights
LVL ----- Level
LWR ----- Lower

MAX ----- Maximum
MB ----- Megabyte
MCM ----- Multi Chip Module
MCP ----- Multi Chip Package
ME ----- Mechanical Engineering
MED ----- Medium
MEM ----- Memory
MFOV ----- Medium Field Of View
MIC ----- Microphone
MIN ----- Minimum
MOD ----- Modification
MOQ ----- Minimum Order Quantity
MOS ----- Metal Oxide Semiconductor
MOSFET ----- Metal Oxide Semiconductor-Field Effect Transistor
MOV ----- Minimum Order Value
MSEC ----- Millisecond
MSG ----- Message
MSTR ----- Master
MTBD ----- Mean Time Between Demands
MTBEMA ----- Mean Time Between Essential Maintenance Action
MTBERA ----- Mean Time Between Essential Replacement Action
MTBF ----- Mean Time Between Failure
MTBMA ----- Mean Time Between Maintenance Action
MTBMCF ----- Mean Time Between Mission Critical Failures
MTBNDR ----- Mean Time Between No Defect Removals
MTBPM ----- Mean Time Between Preventive Maintenance
MTBR ----- Mean Time Between Repair
MTTF ----- Mean Time To Failure
MTTR ----- Mean Time To Repair

NB ----- Narrowband
NORM ----- Normal

OAT ----- Outside Air Temperature
OEM ----- Original Equipment Manufacturer
OJT ----- On the Job Training
OPER ----- Operator
OS ----- Operating System
OSAT ----- Out Source Assembly and Test
OVHD ----- Overhead

P/N ----- Part Number
PAC ----- Pacific
PATT ----- Pattern
PCB ----- Printed Circuit Board
PCR ----- Program Change Request
PE ----- Project Engineer
PERF ----- Performance
PERM ----- Permanent
PGA ----- Pin Grid Array
PiP ----- Packege in Package
PLCC ----- Plastic Leaded Chip Carrier
PM ----- Program Manager
PNL ----- Panel
PO ----- Purchase Order
POL ----- Polarity
P-P ----- Peak-to-Peak
PR ----- Purchase Request
PRI ----- Primary
PROM ----- Programmable Read Only Memory
PSI ----- Pounds per Square Inch
PW ----- Pulse Width
PWR ----- Power

QA ----- Quality Assurance
QA&R ----- Quality Assurance And Revalidation
QAPP ----- Quality Assurance Program Plan
QC ----- Quality Control
QFJ ----- Quad Flat J-leaded Package
QFP ----- Quad Flat Package
QPL ----- Qualified Parts List
QTY ----- Quantity

R ----- Right
R&D ----- Research And Development
RAM ----- Random Access Memory
RDY ----- Ready
REC ----- Record
REF ----- Reference
REJ ----- Reject
REL ----- Release
REM ----- Remote
REP ----- Representative
REQ ----- Required
REQD ----- Required
RF ----- Radio Frequency
RFI ----- Radio Frequency Interference
RFI ----- Request For Information
RFP ----- Request For Proposal
RFQ ----- Request For Quotation
RGT ----- Right
RNG ----- Range
ROI ----- Return On Investment
ROM ----- Read Only Memory
RST ----- Reset
RTN ----- Return

S/N ----- Serial Number
S/W ----- Software
SAM ----- Service Available Market
SAT ----- System Acceptance Testing
SC ----- Source Code
SC ----- Subcontract
SCI ----- Serial Communication Interface
SCN ----- Specification Change Notice
SCP ----- Software Change Proposal
SCR ----- Silicon Control Rectifier
SCTR ----- Sector
SDB ----- Serial Data Bus
SDC ----- Signal Data Converter
SE ----- Software Engineering
SE ----- System Engineering
SEAJ ----- Semiconductor Equipment Association of Japan
SEC ----- Second
SEC ----- Secondary
SEC ----- Secure
SEL ----- Select
SEMI ----- Semiconductor Equipment and Materials International
SEQ ----- Sequence
SIM ----- Subsystem Interface Unit
SIP ----- Single Inline Package
SiP ----- System in Package
SoC ----- System-on-a-Chip
SOJ ----- Small Outline J-leaded
SOL ----- Solenoid
SOP ----- Small Outline Package
SOP ----- Standard Operating Procedure
SOT ----- Small Outline Transistor
SPEC ----- Specification
SPHR ----- Sphere
SPRT ----- Support
SQL ----- Standard Query Language
SRCH ----- Search
STA ----- Station
STBY ----- Standby
STD ----- Standard
STEP ----- Standard for Exchange of Product Model Data
STIM ----- Stimulation
STR ----- Structures
SW ----- Software
SW ----- Switch
SYM ----- Symbology
SYS ----- System
SYSCOM ----- Systems Command
SYST ----- System

TAM ----- Total Available Market
TBA ----- To Be Announced
TBA ----- To Be Assigned
TBD ----- To Be Determined
TCP ----- Tape carrier package
THR ----- Threshold
THX ----- Thanks
TLT ----- Tilt
TPI ----- Threads Per Inch
TQE ----- Torque
TQFP ----- Thin Quad Flat Package
TRAN ----- Transfer
TRQ ----- Torque

UHF ----- Ultra High Frequency
UI ----- User Interface
ULSI ----- Ultra-Large Scale Integration
UPD ----- Update
UPR ----- Upper

VHF ----- Very High Frequency
VLC ----- Very Low Clearance
VLF ----- Very Low Frequency
VLSI ----- Very Large Scale Integration
VLV ----- Valve
VOC ----- Volts Open Circuit

WAN ----- Wide Area Netowrk
WEP ----- Wired Equivalent Privacy
WFOV ----- Wide Field Of View
WID ----- Width
WSI ----- wafer-scale integration
WT ----- Weight
WTHR ----- Weather

YAG ----- Yttrium Aluminum Garnet
YIG ----- Yttrium Iron Garnet
YTD ----- Year To Date

ZIP ----- Zigzag Inline Package